Solidot · Consumer electronics

Large-scale bonding equipment

This consumer electronics application uses XB6S modular remote I/O to address field control, reliable communication and maintainable commissioning.

Application requirements

I/O density, cycle time, motion or process requirements, field distances and maintenance needs are assessed together. This defines the requirements of the working system, not just individual products.

Solution architecture

The proposed architecture combines XB6S modular remote I/O with the machine’s existing control infrastructure and communication protocols. Final product and module selection depends on site requirements.

How can ProControl help?

ProControl can adapt the solution to local project requirements in Türkiye, from site assessment, I/O planning and protocol selection to panel layout, commissioning and after-sales support.

Official application content

Technical details, tables and application images

The technical workflow and visual information from the manufacturer are presented below.

Large-sized bonding equipment is a core asset in precision electronics manufacturing, responsible for mounting various components onto substrates. As panel sizes increase and yield requirements rise, these machines demand high positioning accuracy, multi-axis coordinated motion, and real-time process monitoring, placing stringent requirements on the communication real-time performance and stability of control systems. Implementing Solidot's Remote I/O Module XB6S series significantly reduces wiring complexity and ensures high-speed production.

Solidot Products Used in This Case: XB6S-CB2002 , XB6S-3200 , XB6S-0032A , XB6S-PT04A

I. Production Process Overview

Intelligent Bonding Workflow: Substrate Positioning → Bonding Execution → Pressure Control → Defect Detection

Substrate Positioning: Set bonding coordinates and pressure parameters; vision systems assist transfer mechanisms in precisely positioning substrates.
Bonding Execution: Monitor bonding head position, motor speed, and pressure curve in real-time; perform closed-loop dynamic trajectory adjustments to prevent misalignment or component damage.
Pressure Control: Precisely regulate bonding force and temperature to ensure uniform conductive adhesive curing, preventing cold soldering or substrate damage.
Defect Detection: Identify flaws like weak/no bonds; trigger real-time alarms/reject defective products; log data for process optimization.

II. I/O Module Implementation

The system uses CC-Link IE Field Basic protocol. Solidot modules – digital input XB6S-3200 , digital output XB6S-0032A , and 4-channel PTO pulse output XB6S-PT04A – connect via coupler XB6S-CB2002 to Mitsubishi R32ENCPU PLCs.

XB6S-3200 collects critical signals: substrate presence sensors, safety door locks, and air pressure threshold alarms.

XB6S-0032A controls conveyor motors, vacuum valves, clamping cylinders, alarm lights, and cooling systems.

XB6S-PT04A executes PLC trajectory commands, outputting pulses to servo drives for high-precision X/Y/Z linear motion and rotational positioning of bonding heads.

These modules jointly ensure positional accuracy, closed-loop force control, and multi-axis synchronization for consistent large-panel bonding quality.

Manufacturer application image — Official manufacturer application image

III. Solution Comparison

The legacy solution (relays + standard I/O) had critical flaws: pulse signal interference caused positioning drift during multi-axis motion; complex long-distance wiring increased troubleshooting time and limited scalability. After adopting Solidot’s XB6S Remote I/O:

Field wiring complexity reduced
Pulse signal transmission stabilized
Multi-axis positioning accuracy enhanced
Pressure closed-loop response and synchronization improved
Partial replacement of dedicated motion controllers lowered hardware costs.

IV. High-Reliability Remote I/O Module XB6S Series

Solidot's XB6S series supports multiple fieldbus protocols and integrates motion control/temperature acquisition modules. Certified by rigorous EMC tests, it delivers exceptional noise immunity and connection stability. Features include diagnostics, alarms, anomaly logging, and smart feedback for ease of use.

This content is based on the manufacturer’s published Large-scale bonding equipment application, adapted by ProControl while preserving its technical scope. View the official manufacturer source.