Application requirements
I/O density, cycle time, motion or process requirements, field distances and maintenance needs are assessed together. This defines the requirements of the working system, not just individual products.
Solidot · Semiconductors
Semiconductor chip inspection equipment
This semiconductors application uses XBF distributed I/O to address field control, reliable communication and maintainable commissioning.
Solution architecture
The proposed architecture combines XBF distributed I/O with the machine’s existing control infrastructure and communication protocols. Final product and module selection depends on site requirements.
How can ProControl help?
ProControl can adapt the solution to local project requirements in Türkiye, from site assessment, I/O planning and protocol selection to panel layout, commissioning and after-sales support.
Official application content
Technical details, tables and application images
The technical workflow and visual information from the manufacturer are presented below.
Semiconductor chip inspection demands high precision in signal acquisition, system flexibility, and stability. Solidot's distributed I/O XBF series reduces wiring complexity while enhancing maintainability and scalability, meeting production requirements in complex environments.
Products Used in This Case
XBF4-EC04 , XBF2E-1600 , XBF2E-0016A , XBF2E-0808A
1. Production Process Overview
Semiconductor inspection equipment involves: Wafer Loading → Development → Spin Coating → Defect Scanning → Sorting/Unloading.
- Wafer Loading : Robotic arms transfer wafers; high-precision photoelectric sensors provide real-time positioning feedback.
- Development : Optical sensors scan patterns; edge detection algorithms analyze line-width consistency.
- Spin Coating : Dual-redundant monitoring via pressure transmitters/laser thickness gauges ensures uniform coating.
- Defect Scanning : Multispectral imaging detects micron-level defects; data syncs to quality traceability platforms.
- Sorting/Unloading : Pneumatic actuators sort good/defective products; robots unload via categorized paths.
2. I/O Module Implementation
Based on EtherCAT protocol, the system uses Beckhoff PLCs as the control core. The XBF4-EC04 EtherCAT coupler builds a bus I/O system with:
- 4 expansion ports (32 I/O modules max)
- Supports linear/star/hybrid topologies
- Distributed deployment of XBF2E series modules
Signal Handling :
XBF2E-1600 : Photoelectric sensors (wafer positioning), limit switches (arm travel), safety door interlocks.
XBF2E-0808A : Magnetic cylinder switches (motion status), emergency stop signals.
XBF2E-0016A / XBF2E-0808A : Solenoid valves (sorting cylinders, coating valves), servo signals (conveyor control), alarm indicators.
3. Solution Benefits
Compared to legacy systems (Beckhoff PLC + local I/O + third-party hubs): ✔️ Cost Reduction : 30% lower cabling/accessory costs; eliminated hub procurement. ✔️ Efficiency Gain : 30% faster installation/maintenance with simplified wiring. ✔️ Enhanced Stability : Fewer nodes improve network reliability.
4. Cable-Saving Distributed I/O XBF Series
Standard industrial Ethernet cables (no special tools) • Three-wire sensor power supply (eliminates terminal blocks) • Flexible topologies: linear/star/hybrid • Customizable points/structure/special functions
This content is based on the manufacturer’s published Semiconductor chip inspection equipment application, adapted by ProControl while preserving its technical scope. View the official manufacturer source.